| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module that is reduced in size while suppressing the reduction in efficiency, and to provide a semiconductor device constituting the semiconductor module. <P>SOLUTION: Each of a first semiconductor device 10 and a second semiconductor device 20 includes: a circuit board 2 constituted of a conductor; an FET 3 disposed on a first mount area 21 formed on a principal surface 2A of the circuit board 2; and a Schottky barrier diode (SBD)4 disposed on a second mount area 22 formed on the principal surface 2A of the circuit board 2 and separated from the first mount area 21. Between the first mount area 21 and the second mount area 22 on the circuit board 2, a groove 5 is formed that is an area wherein a thickness of the circuit board 2 is reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT |
