| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a retainer ring and chemical mechanical polishing equipment which realize high-precision planarization of a body to be polished. <P>SOLUTION: The retainer ring which holds the body to be polished in the chemical mechanical polishing equipment has a first ring 11, a second ring 12, which is superimposed on the first ring 11 and is arranged closer to the side of the body to be polished than the first ring 11. The first ring 11 and the second ring 12 are jointed by at least one bolt 13. The second ring 12 has at least one groove 12b, in the surface opposite to the surface which is in contact with the first ring 11. The bolt 13 is situated on the groove 12b. <P>COPYRIGHT: (C)2010,JPO&INPIT |
