| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a means capable of repeatedly using a support substrate when manufacturing a semiconductor device using the support substrate and capable of removing the support substrate in a short time without causing any trouble in a wiring layer and the like constituting the semiconductor device, thereby manufacturing the semiconductor device easily in a short time. <P>SOLUTION: A semiconductor device 30 is obtained by: forming a resin layer 12 composed of a thermoplastic resin on a support substrate 11; forming an insulating layers 13 and 15 and wiring layers 14 and 16 in order; performing a step of form interlayer connectors 17 and 18 by penetrating the insulating layers and electrically conducting the wiring layers; performing the step of mount semiconductor chips 23 and 24 on the wiring layers, heating the resin layer; relatively shifting the support substrate and the insulating layers in a parallel and a perpendicular directions to shear the resin layer; and separating the support substrate and the insulating layers. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
