| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method for easily forming a conductive layer pattern in high productivity; to provide a plating method using a conductive material having excellent durability for plating; and to provide a plating method by which a plating speed is fast to enhance a production efficiency. SOLUTION: In the plating method, a metal is deposited by plating on the conductive base material for plating, in which an insulating layer is formed on the surface and a recessed part made wider toward an opening direction is formed for plating on the insulating layer. The insulating layer on which the recessed part for plating the conductive base material for plating is formed to draw geometric figure or to draw the geometric figure by itself includes diamond-like carbon or an inorganic material. COPYRIGHT: (C)2010,JPO&INPIT |
