| 摘要 |
PROBLEM TO BE SOLVED: To provide a lid for electronic components that is manufactured easily and ensures strength. SOLUTION: The lid has: a substrate member 10 made from one of kovar, SUS, and an iron-nickel alloy; and a plurality of frame members 20 made from one of kovar, SUS, and an iron-nickel alloy. The thickness and width of each frame member 20 are equal to the thickness of the substrate member 10; and a diffused junction is performed while the substrate member 10 and the plurality of frame members 20 are overlapped to form a recess. The diffused junction substrate member 10 and the plurality of frame members 20 are plated with nickel (Ni) or chromium (Cr). Further, they may be plated with gold (Au). COPYRIGHT: (C)2010,JPO&INPIT
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