| 摘要 |
PROBLEM TO BE SOLVED: To facilitate manufacture and to secure strength by joining a substrate member and a plurality of frame members together by diffusion. SOLUTION: A lid body 101 for an electronic component includes the substrate member 10 made of a material selected out of Kovar, SUS, and iron-nickel alloy, and the plurality of frame members 20 made of a material selected out of Kovar, SUS, and iron-nickel alloy, wherein thickness and width values of the plurality of frame members are equal to the thickness value of the substrate member, and the substrate member and the plurality of frame members are joined together by diffusion one over another to form a recessed portion. The substrate member and the plurality of frame members which are joined together by diffusion are plated with nickel (Ni) or chromium (Cr), and further may be plated with gold (Au). COPYRIGHT: (C)2010,JPO&INPIT
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