| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser dicing method which shortens working time and does not lower the efficiency. <P>SOLUTION: A first modification area 22 to be formed nearest to the surface among a plurality of modification areas formed by a laser is formed, the measurement of the surface shape of the wafer is simultaneously executed by measurement scan, and a modification area forming position is controlled on the basis of surface shape data obtained by the measurement scan when forming the modification areas 23, 24, 25 and 26 to be formed at a position deeper than the first modification area on the same cut line as the first modification area. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
