| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a microwave plasma processing apparatus for further reducing damage to a substrate by microwave plasma. <P>SOLUTION: A microwave plasma processing apparatus 10 includes: a processing container 11 which maintains the interior thereof to a reduced pressure; a holding base 13 provided in the processing container 11 and which holds a substrate S; a gas supplying part 31 which supplied gas into the processing container 13; a microwave generator 24 which generates a microwave; a plasma introducing part 20 arranged opposite to the holding base 13 and introducing the microwave generated by the microwave generator 24 into the processing container 11; and a mesh plate 50 arranged between the plasma introducing part 20 and the holding base 13. <P>COPYRIGHT: (C)2010,JPO&INPIT |
