发明名称 MOLDED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>Disclosed is a molded capacitor including a capacitor element coupling member, a cladding member that covers the capacitor element coupling member, and a support member embedded in the cladding member. The capacitor element coupling member contains a capacitor element having an electrode, and a bus bar that couples with the electrode of the capacitor element. The bus bar comprises a terminal portion. The cladding member covers the capacitor element coupling member in such a way that the terminal portion of the bus bar is exposed, and is constituted of a norbornene-based resin. The support member comprises a first end portion that abuts the capacitor element coupling member and a second end portion exposed through the cladding member, and is constituted of a thermally-conductive insulating material. The molded capacitor exhibits high heat resistance, is compact and lightweight, and can be inexpensively produced.</p>
申请公布号 WO2010004704(A1) 申请公布日期 2010.01.14
申请号 WO2009JP03048 申请日期 2009.07.01
申请人 PANASONIC CORPORATION;TAKEOKA, HIROKI;KUBOTA, HIROSHI;SHIMASAKI, YUKIHIRO;FUJII, HIROSHI;OHCHI, YUKIKAZU 发明人 TAKEOKA, HIROKI;KUBOTA, HIROSHI;SHIMASAKI, YUKIHIRO;FUJII, HIROSHI;OHCHI, YUKIKAZU
分类号 H01G4/224;H01G2/08;H01G4/18;H01G4/228 主分类号 H01G4/224
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