发明名称 |
MOLDED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>Disclosed is a molded capacitor including a capacitor element coupling member, a cladding member that covers the capacitor element coupling member, and a support member embedded in the cladding member. The capacitor element coupling member contains a capacitor element having an electrode, and a bus bar that couples with the electrode of the capacitor element. The bus bar comprises a terminal portion. The cladding member covers the capacitor element coupling member in such a way that the terminal portion of the bus bar is exposed, and is constituted of a norbornene-based resin. The support member comprises a first end portion that abuts the capacitor element coupling member and a second end portion exposed through the cladding member, and is constituted of a thermally-conductive insulating material. The molded capacitor exhibits high heat resistance, is compact and lightweight, and can be inexpensively produced.</p> |
申请公布号 |
WO2010004704(A1) |
申请公布日期 |
2010.01.14 |
申请号 |
WO2009JP03048 |
申请日期 |
2009.07.01 |
申请人 |
PANASONIC CORPORATION;TAKEOKA, HIROKI;KUBOTA, HIROSHI;SHIMASAKI, YUKIHIRO;FUJII, HIROSHI;OHCHI, YUKIKAZU |
发明人 |
TAKEOKA, HIROKI;KUBOTA, HIROSHI;SHIMASAKI, YUKIHIRO;FUJII, HIROSHI;OHCHI, YUKIKAZU |
分类号 |
H01G4/224;H01G2/08;H01G4/18;H01G4/228 |
主分类号 |
H01G4/224 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|