TWO-LAYERED FLEXIBLE SUBSTRATE, ITS METHOD OF MANUFACTURING, PRINTED-WIRING BOARD USING THE TWO-LAYERED FLEXIBLE SUBSTRATE, AND ITS METHOD OF MANUFACTURING

摘要

<P>PROBLEM TO BE SOLVED: To provide a two-layered flexible substrate suitable for forming a fine pattern and COF mounting and a printed-wiring board. Ž<P>SOLUTION: In the two-layered flexible substrate in which a backing metal layer is formed directly on at least one side of an insulator film without making an adhesive intervene, and a copper conductor layer having a desired layer thickness is formed on the backing metal layer, the backing metal layer mainly contains nickel-chromium or nickel-chromium-molybdenum with 3.1-3.8 atom% of oxygen atoms solid-dissolved. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž