| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate that attains superior reliability in carrying out connection between wiring conductors through via hole conductors, and to provide a method for manufacturing the substrate. SOLUTION: The present invention relates to a wiring substrate and a method for manufacturing the same, which not only a plurality of insulating resin layers 1 containing thermosetting resins and have product regions 10A and redundancy regions 10B surrounding product regions 10A, but also conductive layers 2 comprising metal foils having wiring conductors at positions corresponding to the product regions 10A are laminated alternately, and the wiring conductors disposed by being sandwiched between upper and lower portions of the insulating resin layers 1 are connected by via hole conductors 3a comprised of conductive materials, containing the thermosetting resins filled in via holes 1V for the wiring connection which penetrate with the product regions 10A of the insulating resin layer 1. Additionally, dummy via holes 1D are formed in the redundant regions 10B of the insulating resin layer 1, and dummy via hole conductors 3b comprised of the conductive materials are filled in the dummy via holes 1D. COPYRIGHT: (C)2010,JPO&INPIT |
