发明名称 FLEXIBLE SUBSTRATE AND ELECTRIC CIRCUIT STRUCTURE
摘要 <p>Provided is a flexible substrate wherein a short-circuit failure due to circuit pattern cutting particles generated when the flexible substrate is punched is reduced.  An electric circuit structure, which has the flexible substrate and an electric circuit substrate to which the flexible substrate is connected, is also provided.  A flexible substrate (100) has a wiring pattern (2) formed on a flexible base film (1).  The flexible substrate (100) is provided by being punched to be individually separated in a state where the wiring pattern (2) is formed on the base film (1), and the wiring pattern (2) has a small width section (2c) having a small width at an end section of the base film (1).</p>
申请公布号 WO2010004875(A1) 申请公布日期 2010.01.14
申请号 WO2009JP61505 申请日期 2009.06.24
申请人 SHARP KABUSHIKI KAISHA;KAWAMURA TERUO;ETOH TOSHIO 发明人 KAWAMURA TERUO;ETOH TOSHIO
分类号 H05K1/11;G02F1/1345;H05K1/02 主分类号 H05K1/11
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