| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed substrate and an electronic device such that an obstruction to electric connection is prevented. <P>SOLUTION: The printed substrate 30 includes: a plurality of pads 32 provided in a mounting area 30R in which a BGA package 50 is mounted; and a hole 35 extending along two adjacent sides at a position opposed to a peripheral edge of the mounting area 30R. The hole 35 is provided at such the opposite position to reduce the load on bumps 53a of the BGA package 50, thereby preventing the bumps 53a from peeling from the printed substrate 30. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
