发明名称 DEVICE AND METHOD FOR HEATING SUBSTRATES
摘要 PURPOSE: A device and a method for heating substrates are provided to maximize a working capacity by including a substrate support block loading a plurality of substrates and heating them. CONSTITUTION: In a device and a method for heating substrates, a block unit(10) comprises a plurality of supporting substrate blocks. The substrate support block is formed around a penetration hole which passes up and down. The supporting substrate block respectively has a support surface in which the substrate is contacted and supported. The supporting substrate block has support surfaces which are separated from each other. A heater(20) heats the substrate supported by the supporting surface of the supporting substrate block. The block unit and the heater can move relatively through penetration holes(111,121) to the upward and downward.
申请公布号 KR20100004643(A) 申请公布日期 2010.01.13
申请号 KR20080064926 申请日期 2008.07.04
申请人 TES CO., LTD. 发明人 LEE, JAE HOON
分类号 H01L21/02;H01L21/20 主分类号 H01L21/02
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