| 摘要 |
<p>The method involves generating individual actuating variables for a breaking block for a substrate from substrate-specific, pre-stored characteristic data. The actuating variables are selected between a mode with a constant contact pressure for reference break lines and another mode with individual variable contact pressure values for the reference break lines depending on the substrate-specific characteristic data. The reference break lines are marked by scratching on an upper side of semiconductor disks. An independent claim is also included for a device for breaking semiconductor disks and/or wafer, and ceramic- and glass disks.</p> |
