发明名称 |
HEAT DISSIPATION APPARATUS AND METHOD IN LIQUID CRYSTAL DISPLAY DEVICE |
摘要 |
PURPOSE: A heat dissipation apparatus and a method in a liquid crystal display device are provided to emit heat generated from an inverter by mounting a thermal pad of a semiconductor chip on the heater of the inverter through a surface mounting technology. CONSTITUTION: In a heat dissipation apparatus and a method in a liquid crystal display device, a thermal pad is manufactured as a semiconductor chip form. An inverter device is loaded in a target position on an inverter board. A semiconductor chip type thermal pad(33) is attached around a trans, or a main integration device, or transistor through a surface mounting technology. A land is mounted on a metal mask of the inverter board to mounting all kinds of the devices as a chip mount. The land for the semiconductor chip type thermal pad is formed. The transistor(32) is a switching transistor(FET).
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申请公布号 |
KR20100004752(A) |
申请公布日期 |
2010.01.13 |
申请号 |
KR20080065097 |
申请日期 |
2008.07.04 |
申请人 |
LG DISPLAY CO., LTD. |
发明人 |
PARK, YUN SEO;KIM, SUNG JOONG |
分类号 |
H01L23/34;H01L21/60;H05K3/30;H05K7/20 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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