| 摘要 |
PURPOSE: An LED package is provided to prevent internal structural deformation at a high or extremely low temperature by mounting one LED chip inside a cavity after forming a plurality of cavities on a heat sink comprised of double metal layer. CONSTITUTION: A heat sink(110) is comprised of a metal layer and a plurality of cavities are formed on the heat sink. A second lead frame(130) is separated from the heat sink and a first lead frame(120) extended to one side of the heat sink. A mold unit(140) fixes the heat sink, the first lead frame, and the second lead frame. A plurality of LED chips(150) are individually mounted inside the cavity. A first filler(160) is filled inside the cavity to protect the LED chip. The inner surface of the cavity is inclined. The molding unit has a larger opening than the cavity.
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