LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A light emitting device package and a manufacturing method thereof are provided to improve productivity by performing a dispensing method with a lining method by forming a hole part on a substrate to coat the molding agent around the light emitting chip with the surface tension. CONSTITUTION: A hole part(11) is formed on at least part of surroundings for mounting a light emitting chip(30) on a substrate(10). A first molding unit(50) includes a fluorescent material(51). The molding agent is coated on the region except the hole part to encapsulate the light emitting chip. A plurality of hole parts are formed on the surroundings for mounting the light emitting chip. The hole part has a dot or slot shape. The second molding part encapsulates the first molding unit. The hole part formed on the substrate is separately arranged on the substrate with a lattice shape.