| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip component equipped with an external electrode which allows both connection by an interlayer connection conductor and connection by soldering and a method for manufacturing a module with built-in component in which the chip component is built in. <P>SOLUTION: At least an electrode portion 31 of one main plane side of an insulating layer in an external electrode 3 of the end portion of a chip component 1A built in the insulating layer of the module with built-in component is made from metal different from that of a remaining electrode portion 32 of the external electrode 3 to form the chip component 1A. In this case, for example, the electrode portion 31 is made from metal suitable for connection with the interlayer connection conductor such as a via conductor or a through-hole conductor of the module with built-in component, the electrode portion 32 is made from metal suitable for soldering, thereby connecting the electrode of the one main plane side of the insulating layer of the module with built-in component and the electrode of the other main plane by the external electrode 3 for low profiling and miniaturizing of the module with built-in component. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
