LEAD-FREE SOLDER ALLOY AND ELECTRONIC COMPONENT HAVING SOLDER BALL AND SOLDER BUMP

摘要

PROBLEM TO BE SOLVED: To provide a lead-free solder alloy which is a lead-free solder alloy to be used for joining mother board substrates or the like and has high impact shear fracture strength required for mobile electronic devices, and electronic components having solder balls and solder bumps of the solder alloy. SOLUTION: The lead-free solder alloy used to join electronic components contains, by mass, 0.1-200 ppm Be and the balance being Sn, so that impact shear fracture strength is significantly improved at the solder joined part. COPYRIGHT: (C)2010,JPO&INPIT