发明名称 LED LENSE AND LED PACKAGE MODULE USING THE SAME
摘要 PURPOSE: An LED lens and an LED package module using the same are provided to improve the radiation efficiency and durability of the LED lens by preventing a coating resin from being overflowed from a lens mounting surface in coating the coating resin. CONSTITUTION: In an LED lens and an LED package module using the same, a lens unit(110) is installed at an upper part of an LED chip and emits the light from the LED chip to the outside. A lead unit(120) is expanded along the circumference of the lens unit to outside. A resin sealing unit(130) comprises the sidewall that surrounds the edge of the lead unit. The lead unit is lower than the LED chip.
申请公布号 KR20100002468(A) 申请公布日期 2010.01.07
申请号 KR20080062373 申请日期 2008.06.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 ARIYOSHI TETSUO;JUNG, MYOUNG SIK
分类号 H01L33/54;H01L33/52;H01L33/62 主分类号 H01L33/54
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