发明名称 |
LED LENSE AND LED PACKAGE MODULE USING THE SAME |
摘要 |
PURPOSE: An LED lens and an LED package module using the same are provided to improve the radiation efficiency and durability of the LED lens by preventing a coating resin from being overflowed from a lens mounting surface in coating the coating resin. CONSTITUTION: In an LED lens and an LED package module using the same, a lens unit(110) is installed at an upper part of an LED chip and emits the light from the LED chip to the outside. A lead unit(120) is expanded along the circumference of the lens unit to outside. A resin sealing unit(130) comprises the sidewall that surrounds the edge of the lead unit. The lead unit is lower than the LED chip.
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申请公布号 |
KR20100002468(A) |
申请公布日期 |
2010.01.07 |
申请号 |
KR20080062373 |
申请日期 |
2008.06.30 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
ARIYOSHI TETSUO;JUNG, MYOUNG SIK |
分类号 |
H01L33/54;H01L33/52;H01L33/62 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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