| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique capable of improving an anti-shock property of a solder joint. <P>SOLUTION: A semiconductor device has joint structures in which a joint layer 7 provided between an underlying conductive layer and a lead-free solder layer and substantially not containing sulfur and, and an alloy layer 9a provided between the joint layer and the lead-free solder layer containing elements of these layers are formed. Therein, the joint layer is a plated layer mainly containing nickel or nickel-phosphorus, and the solder layer is a bump 14 made of a zinc-alloy material. The underlying conductive layer is an electrode-pad 6 of a wiring board, the joint layer is a plated layer formed on the surface of the electrode pad, and the solder layer is a bump joined to the joint layer. <P>COPYRIGHT: (C)2010,JPO&INPIT |
