| 摘要 |
A package-on-package (pop) stack (310) includes an upper package (402), an optical interface (502,602-1,602-2,704), and a lower package (404). The upper package sends an optical signal from a first component in the upper package. The optical interface receives the optical signal from the upper package, and transmits the optical signal. The lower package receives the optical signal from the optical interface, and may relay the optical signal to a second component in the lower package or at the motherboard. |
