发明名称 CONDUCTIVE WIRE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE CONDUCTIVE WIRE
摘要 PURPOSE: A conductive wire, a manufacturing method thereof, and a semiconductor package including the same are provided to prevent electric short between conductive wires by narrowly arranging the conductive wires even through the conductive wires are mutually contacted. CONSTITUTION: A conductive wire unit(10) includes metal particles and has a line shape. An insulation layer(20) surrounds the conductive wire and is made of the polymer. A reactor layer(30) is interposed between the conductive wire unit and the insulation layer. The reactor layer has a reactor connecting the polymer with each metal particle.
申请公布号 KR20100002862(A) 申请公布日期 2010.01.07
申请号 KR20080062911 申请日期 2008.06.30
申请人 HYNIX SEMICONDUCTOR INC. 发明人 HWANG, TAE SEON
分类号 H01L23/49 主分类号 H01L23/49
代理机构 代理人
主权项
地址
您可能感兴趣的专利