| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a production process of a flexible circuit board in which a sufficient adhesion strength is provided between a polyimide layer and a conductor layer after circuit formation, and which prevents the adhesion strength from being deteriorated after heat loading, and also to provide the flexible circuit board made by this production method. Ž<P>SOLUTION: The production method of a flexible circuit board includes: a printing step of printing a drawing solution as a circuit pattern onto a surface of a plastic film as a base material; an immersion step of immersing a circuit pattern printed plastic film in a super-critical carbon dioxide solution made by melting a metal complex; and a metal separation step of separating metal alone that constitutes the metal complex only on a circuit pattern portion printed on the surface of the plastic film in the super-critical carbon dioxide solution. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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