发明名称 |
LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a light-emitting diode for preventing thermal deterioration in an aggregate of fibers caused by heat generation of an LED chip even if a heat-resistance temperature of the fibers for composing the aggregate of fibers is not more than 120°C. <P>SOLUTION: The LED 10 includes: an LED chip 20; and a nonwoven cloth 30 that carries a phosphor 28 and allows a number of gaps 34 to be formed between fibers 32. In the LED, the heat-resistance temperature of the fibers 32 is not more than 120°C. The nonwoven cloth 30 is impregnated with a heat-resistance binder 36 that has light transmission properties and is made of a material having a heat-resistance temperature higher than 150°C. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010003790(A) |
申请公布日期 |
2010.01.07 |
申请号 |
JP20080159920 |
申请日期 |
2008.06.19 |
申请人 |
OKAYA ELECTRIC IND CO LTD |
发明人 |
RAIKUBO AKIHITO;KATO AKIHIRO |
分类号 |
H01L33/48;D06M11/36;D06M11/79 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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