发明名称 LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To achieve a light-emitting diode for preventing thermal deterioration in an aggregate of fibers caused by heat generation of an LED chip even if a heat-resistance temperature of the fibers for composing the aggregate of fibers is not more than 120&deg;C. <P>SOLUTION: The LED 10 includes: an LED chip 20; and a nonwoven cloth 30 that carries a phosphor 28 and allows a number of gaps 34 to be formed between fibers 32. In the LED, the heat-resistance temperature of the fibers 32 is not more than 120&deg;C. The nonwoven cloth 30 is impregnated with a heat-resistance binder 36 that has light transmission properties and is made of a material having a heat-resistance temperature higher than 150&deg;C. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010003790(A) 申请公布日期 2010.01.07
申请号 JP20080159920 申请日期 2008.06.19
申请人 OKAYA ELECTRIC IND CO LTD 发明人 RAIKUBO AKIHITO;KATO AKIHIRO
分类号 H01L33/48;D06M11/36;D06M11/79 主分类号 H01L33/48
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