发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR OPTICAL ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor optical element capable of preventing a semiconductor wafer from being damaged during a manufacturing process of the semiconductor optical element. SOLUTION: This method of manufacturing the semiconductor optical element includes: a first process of growing a semiconductor laminate 13 including an active layer 17 on a substrate 11; a second process of forming a silicon oxide film 21 having predetermined film stress and a predetermined thickness on the semiconductor laminate 13 after the first process; a third process of forming a stripe-like groove 25 on the silicon oxide film 21 by etching the silicon oxide film 21 until a surface of the semiconductor laminate 13 is exposed by using a resist 23 formed on the silicon oxide film 21 after the second process; and a fourth process of growing another part 19b of a p-type clad layer 19 in the groove 25 after the third process. COPYRIGHT: (C)2010,JPO&INPIT
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申请公布号 |
JP2010003923(A) |
申请公布日期 |
2010.01.07 |
申请号 |
JP20080162219 |
申请日期 |
2008.06.20 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
NOMAGUCHI TOSHIO;HATTORI TETSUYA;FUJIMOTO KAZUNORI |
分类号 |
H01S5/223;C23C16/42;C23C16/507;H01L21/205 |
主分类号 |
H01S5/223 |
代理机构 |
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地址 |
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