发明名称 LAMINATE, PREPREG, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR MOUNTING LED
摘要 <P>PROBLEM TO BE SOLVED: To provide a composite laminate excellent in thermal conductivity, heat resistance, drill wear resistance and flame retardancy. Ž<P>SOLUTION: The composite laminate 10 is produced by integrally laminating the surface material layers 2 obtained by impregnating a woven fabric base 2a with a resin composition 2b to both surfaces of a core material layer 1 obtained by impregnating a nonwoven fabric base 1a with a resin composition 1b which contains a filler including gibbsite type aluminum hydroxide, boehmite type hydroxide and aluminum oxide. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010000774(A) 申请公布日期 2010.01.07
申请号 JP20080287046 申请日期 2008.11.07
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 SUZUE TAKAYUKI;NOZUE AKIYOSHI
分类号 B32B5/28;B32B15/08;H01L23/14;H05K1/03 主分类号 B32B5/28
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