发明名称 |
LAMINATE, PREPREG, METAL FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR MOUNTING LED |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composite laminate excellent in thermal conductivity, heat resistance, drill wear resistance and flame retardancy. Ž<P>SOLUTION: The composite laminate 10 is produced by integrally laminating the surface material layers 2 obtained by impregnating a woven fabric base 2a with a resin composition 2b to both surfaces of a core material layer 1 obtained by impregnating a nonwoven fabric base 1a with a resin composition 1b which contains a filler including gibbsite type aluminum hydroxide, boehmite type hydroxide and aluminum oxide. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2010000774(A) |
申请公布日期 |
2010.01.07 |
申请号 |
JP20080287046 |
申请日期 |
2008.11.07 |
申请人 |
PANASONIC ELECTRIC WORKS CO LTD |
发明人 |
SUZUE TAKAYUKI;NOZUE AKIYOSHI |
分类号 |
B32B5/28;B32B15/08;H01L23/14;H05K1/03 |
主分类号 |
B32B5/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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