| 摘要 |
PURPOSE: A stacked semiconductor package with localized cavities for a wire bonding and a method of fabricating the same are provided to lower the height of dies by arranging the localized cavities at the desired sides of dies. CONSTITUTION: A stacked semiconductor packages comprises semiconductor dies(102a,102b,102c). The semiconductor die comprises an integrated circuit, die bond pads, and localized cavities(110). The die bond pads are formed on the active surface of the semiconductor die. The localized cavities are formed along more than one side on non-active surface of the semiconductor die. In this case, the localized cavities are arranged at a part of the sides of the semiconductor die. |
