发明名称 |
CHARGED PARTICLE BEAM MACHINING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a charged particle beam machining apparatus that implements an improved apparatus availability factor by avoiding a machining error caused by a charging phenomenon of sputter emitted from a beam diaphragm. SOLUTION: The material of the beam diaphragm is predetermined such that a deposited film on an optical element surface downstream of the beam diaphragm which is generated by sputter particles emitted from the beam diaphragm is conductive. Preferably, the material of the beam diaphragm is carbon or a compound thereof. More preferably, an electrode having an electric potential is arranged downstream of the beam diaphragm. COPYRIGHT: (C)2010,JPO&INPIT
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申请公布号 |
JP2010003596(A) |
申请公布日期 |
2010.01.07 |
申请号 |
JP20080162670 |
申请日期 |
2008.06.23 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
ISHIGURO KOJI;SHICHI HIROYASU;TOMIMATSU SATOSHI;UMEMURA KAORU;KANEOKA NORIYUKI |
分类号 |
H01J37/305;H01J37/09;H01J37/16 |
主分类号 |
H01J37/305 |
代理机构 |
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