| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem, wherein in conventional heat-dissipating substrates, when the number or the like of heat-generating components to be mounted is increased, an area (for example, a projected area or a floor area) of a module is increased, thereby increasing the size of equipment mounted with the module. SOLUTION: A module 23 comprises a heat-dissipating substrate 11, which is constituted of a plurality of metal plates 12a, 12b and each lead frame 14 or the like fixed on each metal plate by each heat-transfer layer 13, and a circuit board 24 connected to the heat-dissipating substrate. An inter-board connecting terminal 21 which is a part of the lead frame 14 is bent so as to sandwich the circuit board 24 therebetween, thereby attaining size reduction and space saving for the module 23, and contributing to the size reduction of equipment into which the module is incorporated. COPYRIGHT: (C)2010,JPO&INPIT |
