| 摘要 |
<p>PURPOSE: A ceramic package is provided to improve thermal transfer efficiency and adhesive force by dispersing an adhesive on the bottom of the semiconductor chip uniformly. CONSTITUTION: A ceramic package includes a main body(10), a plurality of connector areas(30), and a metallic foil(20). The main body has a cavity for accepting the semiconductor chip. The main body is formed with ceramics. A plurality of connector areas are respectively connected to a plurality of electrical terminals of the semiconductor chip through wire. The metal thin film is arranged on the bottom of the cavity of the main body. The semiconductor chip is attached to the metal thin film. The metal thin film is formed as a net having a plurality of holes. The metal thin film is formed with a tungsten layer, a nickel layer, and gold layer.</p> |
