SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device and a method for manufacturing the same are provided to allow heat generated each chip to be radiated through a heat sink by forming the heat sink on the circumference of the semiconductor. CONSTITUTION: A semiconductor chip(10) of a wafer level is covered with a protective film(18). A through silicon via(16) is penetrated in a vertical direction from an adjacent region to a bonding pad(22) of a semiconductor chip. A conductive metal(14) is buried to the through silicon via. A protective film is removed from the circumference of the top of the semiconductor chip, and the heat sink is formed by filing and coating from at the removed place. Semiconductor chips are laminated up and down while contacting conductive metals of the through silicon via and heat sink.