Moveable arm assembly for a wire bonder

摘要

A wire bonding machine includes a moveable arm assembly and at least one component for a ball bonding operation of the wire bonding machine supported by the moveable arm assembly. The moveable arm assembly is configured to move between a ball bonding position and a wedge bonding position. When the moveable arm assembly is in the ball bonding position the at least one component for the ball bonding operation is in a predetermined position for use in the ball bonding operation.