发明名称 |
Apparatus and methods of forming package-on-package interconnects |
摘要 |
Embodiments of an apparatus and methods of forming a package on package interconnect and its application to the packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
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申请公布号 |
US2009320281(A1) |
申请公布日期 |
2009.12.31 |
申请号 |
US20080215550 |
申请日期 |
2008.06.27 |
申请人 |
ARANA LEONEL;NICKERSON ROB;SIM LIM CHONG;PRACK EDWARD;TOMITA YOSHIHIRO |
发明人 |
ARANA LEONEL;NICKERSON ROB;SIM LIM CHONG;PRACK EDWARD;TOMITA YOSHIHIRO |
分类号 |
H01R9/00 |
主分类号 |
H01R9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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