| 摘要 |
There is provided a semiconductor device 10 including a solder resist 16 for protecting a wiring pattern 14 electrically connected to a semiconductor chip 11 via an internal connection terminal 12, characterized in that the solder resist 16 is arranged to cover the upper surface of the portion of the wiring pattern 14 not corresponding to the arrangement region of the external connection terminal 17 and the side surface 14B of the wiring pattern 14 and that the area of the solder resist 16 assumed when the upper surface 13A of an insulation layer 13 is viewed from above is substantially the same as that of the wiring pattern 14 assumed when the upper surface 13A of the insulation layer 13 is viewed from above.
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