| 摘要 |
In some embodiments, an injection molded metal stiffener and integrated carrier for packaging applications is presented. In this regard, an apparatus is introduced comprising a microelectronic device package substrate, a microelectronic device coupled with a top surface of the package substrate, and an injection-molded, metal stiffener coupled with the package substrate, wherein the stiffener includes a central opening and at least partially surrounds the microelectronic device, and wherein the stiffener includes an overhang that extends along a side of the package substrate and incorporates a coupling feature. Other embodiments are also disclosed and claimed. |
