发明名称 COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT AND ELECTRICAL/ELECTRONIC COMPONENT USING THE SAME
摘要 <p>Disclosed is a composite material for electrical/electronic components used as a material for an electrical/electronic component, wherein an insulating film is formed on at least a part of a metal base at least the surface of which is composed of Cu or a Cu alloy.  A metal layer wherein Cu is dispersed in Ni or an Ni alloy is arranged between the metal base and the insulating film, and the ratio of the number of Cu atoms to the number of Ni atoms (Cu/Ni) is not less than 0.005 when the outermost surface of the metal layer is measured by Auger electron spectroscopy.</p>
申请公布号 WO2009157456(A1) 申请公布日期 2009.12.30
申请号 WO2009JP61429 申请日期 2009.06.23
申请人 THE FURUKAWA ELECTRIC CO., LTD.;SUGAHARA, CHIKAHITO;ZAMA, SATORU;TACHIBANA, AKIRA 发明人 SUGAHARA, CHIKAHITO;ZAMA, SATORU;TACHIBANA, AKIRA
分类号 C23C26/00;C22C19/03;C25D7/00 主分类号 C23C26/00
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