| 摘要 |
<p>PURPOSE: A wafer level stack package, a manufacturing method thereof, and a semiconductor manufacturing apparatus are provided to prevent a contact failure by forming a bump and a through electrode inside a via through high pressure injection at the same time. CONSTITUTION: A wafer level stack package includes a plurality of semiconductor packages(110~140). The semiconductor packages are laminated by adhesives. Each semiconductor package includes a wafer(111) and a contact pad(113). The contact pad is arranged to one surface of the wafer. A via penetrates the contact pad and the wafer. A through electrode(160) is formed inside the via. A contact terminal(170) is formed to one of the semiconductor packages.</p> |
