| 摘要 |
An LED device comprises an LED 16 mounted upon a circuit board 10, an electrical connector 14 carried by the circuit board 10, and a heat sink 20 carried by the circuit board and arranged to conduct heat away from the LED 16. Preferably the LED 16 comprises an array of micro-LEDs 18 which may emit ultra-violet (UV) wavelengths. The structural form of the heat sink 20 may also be tapering, conical, hollow or any combination thereof. A manifold is also disclosed for holding a plurality of LED devices which may also provide cooling via either air, gas or liquid. |
