发明名称 TEST CONTACT ARRANGEMENT
摘要 The invention relates to a test contact arrangement (15) for testing semiconductor components, comprising at least one test contact (10) arranged in a test contact frame (13) of the type of a cantilever arm, a fastening base (12) and a contact arm (30) which is provided with a contact tip (11) and connected to the fastening base. According to the invention, the fastening base is inserted with its fastening projection (16) into a frame opening (14) of the test contact frame in such a manner that a lower edge (17) of the fastening projection is essentially aligned flush with a lower side (18) of the test contact frame.
申请公布号 WO2009117992(A3) 申请公布日期 2009.12.30
申请号 WO2009DE00393 申请日期 2009.03.27
申请人 PAC TECH - PACKAGING TECHNOLOGIES GMBH;AZDASHT, GHASSEM 发明人 AZDASHT, GHASSEM
分类号 G01R1/073;G01R1/067 主分类号 G01R1/073
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