发明名称 |
Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish |
摘要 |
There is provided a varnish of a low dielectric loss tangent resin composition which is low in viscosity and excellent in storage stability. The varnish of a low dielectric loss tangent resin composition contains a thermosetting monomer (A) having a weight average molecular weight of not more than 1,000, a high polymer (B) having a weight average molecular weight of not less than 5,000, a halogen flame-retardant agent (C), a silicon dioxide filler (D), and an organic solvent (E). The average particle diameter of each the components (C) and (D) is in the range of 0.2 to 3 mum.
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申请公布号 |
US7638564(B2) |
申请公布日期 |
2009.12.29 |
申请号 |
US20060529661 |
申请日期 |
2006.09.29 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
AMOU SATORU;AKAHOSHI HARUO;NAKAMURA YOSHIHIRO;MINAMI NOBUYUKI;MURAI YASUHIRO |
分类号 |
C08K5/3447;C08K3/34;C08K5/03 |
主分类号 |
C08K5/3447 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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