发明名称 |
LIGHT EMITTING DIODE PACKAGE HAVING DOME TYPE ENCAPSULATION LAYER AND METHOD FOR FABRICATING THE SAME |
摘要 |
<p>PURPOSE: A light emitting diode package having a dome type encapsulation layer and a method for fabricating the same are provided to protect a light emitting diode chip by forming a domed passivation layer high according to block of the dispersion of a sealed fluid. CONSTITUTION: In a device, a package substrate(11) includes a peripheral area that surrounds an element area and the element area. Bonding pads(21,22) are formed on the element area of the package substrate. A heat sink(30) is arranged at the bottom of the package substrate. Housing(12) having a cavity is arranged on the peripheral area of the package substrate. A concavo-convex region(50) is formed on the housing. The concavo-convex region includes a plurality of protrusions(51,52,53,54) which surrounds the element area. A light emitting diode chip(40) is arranged at one among bonding pads exposed within the cavity. The domed sealed layer(60) is formed by dotting fluid on the light emitting diode chip.</p> |
申请公布号 |
KR20090131040(A) |
申请公布日期 |
2009.12.28 |
申请号 |
KR20080056811 |
申请日期 |
2008.06.17 |
申请人 |
KOREA PHOTONICS TECHNOLOGY INSTITUTE |
发明人 |
KIM, JAE PIL;KIM, YOUNG WOO;SIM, JAE MIN;SONG, SANG BIN |
分类号 |
H01L33/52;H01L33/54 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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