发明名称 POLISHING APPARATUS OF SUBSTRATE END FACE AND POLISHING DETERMINING METHOD
摘要 PURPOSE: A substrate edge polishing device and a polishing determining method are provided, which judge polishing state accurately by setting upper and lower limits of load current. CONSTITUTION: A substrate edge polishing device comprises a polishing wheel(10), a rotation driving unit(20) of the polishing wheel, and a cutting edge transfer unit of the polishing wheel. The polishing wheel polishes cross section(1a) of a substrate. The rotation driving unit of the polishing wheel has a load current correcting unit and load current detection unit. The load current detection unit detects the load current by contact with the cross section of the substrate. The correcting unit corrects the load current which is generated since the side of the worn groove(14) of the polishing wheel comes into contact with the substrate.
申请公布号 KR20090131268(A) 申请公布日期 2009.12.28
申请号 KR20090053921 申请日期 2009.06.17
申请人 NAKAMURA-TOME PRECISION INDUSTRY CO., LTD.;AVANSTRATE INC. 发明人 TATSUDA KATSUHIKO;YAMAGISHI SOUSHI;IKAI OSAMU;MATSUOKA YUTAKA;ISE HIRONORI
分类号 B24B49/16;B23Q15/12;B24B9/08 主分类号 B24B49/16
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