| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus with a dielectric plate applied with surface processing. <P>SOLUTION: The plasma processing apparatus 100 is provided with a processing vessel 10 inside which plasma is excited in a required vacuum state, a microwave source 900 supplying microwave in the processing vessel for exciting plasma, and a dielectric plate 305 facing inside the processing vessel 10 for transmitting the microwave supplied from the microwave source 900 into the processing vessel. A face of the dielectric plate 305 at least shielding the vacuum from atmospheric air is coated with a metal film 305a (or a metal composite film). <P>COPYRIGHT: (C)2010,JPO&INPIT |
