| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board on which a semiconductor element is mounted without performing pattern change nor lead processing when a lead position of the semiconductor element is changed. Ž<P>SOLUTION: According to claim 1, a printed circuit board having through-holes formed matching a plurality of lead terminals of a semiconductor element is characterized in that the through-holes are formed in an oblong hole shape and spacers adaptive to change in lead position of the semiconductor element are mounted on the through-holes. According to claim 2, a printed circuit board having through-holes formed matching a plurality of lead terminals of a semiconductor element is characterized in that the through-holes are formed in a circular hole shape having a larger diameter than the lead terminals and spacers adaptive to change in lead position of the semiconductor element are mounted on the through-holes. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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