METHOD FOR MANUFACTURING CONTACT STRUCTURE

摘要

PURPOSE: A method for manufacturing a contact structure is provided to improve the reliability of a test process by using a second motherboard having a first motherboard and an opening having a conductive layer. CONSTITUTION: In a device, a first motherboard is prepared(S100). A bonding layer is formed on the first substrate through a sputtering process. A conductive layer is formed on the bonding layer through an evaporation process or the sputtering process. A second motherboard is prepared(S200), and the second substrate is formed on the second motherboard. An insulating layer is formed on the second substrate. A photoresist layer is formed on the insulating layer. The second motherboard is adhered on the first motherboard(S300). A contact structure is formed(S400), and the first motherboard and the second motherboard are removed(S500).