发明名称 VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus and a vapor deposition method, in which the film thickness of a vapor deposition film can be detected with high detection accuracy and a vapor deposition film having a desired film thickness can be stably formed. Ž<P>SOLUTION: The vapor deposition apparatus 1 sublimes a vapor deposition material M and deposit the material at a predetermined vapor deposition position, and is equipped with: a housing container 4 having an opening 4a and housing the vapor deposition material M; a detecting mechanism detecting a deposition amount of the vapor deposition material M at a detection position different from the above vapor deposition position; and a control mechanism changing the detecting position in accordance with the shape of the vapor deposition material M in the housing container 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009299159(A) 申请公布日期 2009.12.24
申请号 JP20080156478 申请日期 2008.06.16
申请人 SEIKO EPSON CORP 发明人 FUKASE AKIO
分类号 C23C14/24 主分类号 C23C14/24
代理机构 代理人
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