| 摘要 |
A printed circuit board, an electronic instrument, and a semiconductor package are provided that are excellent in bonding strength and easy in rework. The printed circuit board includes a printed wiring board, an electronic device that is the semiconductor package, and an adhesion part. A protection member of the electronic device is arranged along the periphery of a mounting surface of a package body so as to abut a mounting surface of the printed wiring board. The adhesion part is provided in a stepped part defined by a peripheral wall of the electronic device and part of the mounting surface of the printed wiring board in the vicinity of the electronic device. |
