| 摘要 |
PURPOSE: A half-hole cutting method of a COB PCB is provided to perform plating on a multilayer PCB to form a copper foil in the inside of a through hole, thereby completing the inter-layer connection of the multilayer PCB. CONSTITUTION: In a both-sided copper foil lamination(1), conductive layers(1a,1b) are formed in both sides of the upper and lower sides. A hole is punched in the desired location of the both-sided copper foil lamination. Plasma cleaning is performed for the punched hole. Copper plating is performed for the both-sided copper foil lamination with the punched hole. Then, the copper of a conductor is formed. Etching is performed in the conductive layer of both sides of the both-sided copper foil lamination in order to form a desired circuit pattern. A prepreg of a bonding member is inserted between both-sided PCB(Printed Circuit Board). The both-sided PCB is pressurized and heated by hot press. Then, a multilayer PCB is formed.
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